1 / 3 www.asb.co.kr november 2008 p lerow tm aln1747at internally matched lna module the plerow tm aln - series is the compactly designed surface - mount module for the use of the lna with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation terminals , catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. the surface - mount module package including the completed matching circuit and other components necessary just in c ase allows very simple and convenient implementation onto the system board in mass production level. parameter unit specifications min typ max frequency range mhz 1710 1785 gain db 12 13 gain flatness db ? 0.2 ? 0.4 noise figure db 0.7 0.75 output ip3 (1) dbm 32 33 s11 / s22 (2) db - 19/ - 19 output p1db dbm 16 17 switching time ? sec - supply current ma 65 80 supply voltage v 5 impedance ? 50 max. rf input power dbm c.w 29 ~ 31 (before fail) package type & size mm surface mount type, 10wx10lx3.8h operating temperature is - 40 ? c to +85 ? c. 1) oip3 is measured with two tones at an output power of 0 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage fr om 0 v to v s . pin number function 2 rf in 5 rf out 6 +vcc other s ground ou t line drawing (unit: mm) feature s s 21 = 13.2 db @ 1710 mhz = 12.8 db @ 1785 mhz nf of 0.7 db over fr e quency unconditionally stable single 5v supply high oi p3 @ low current note: 1. the number and size of ground via holes in a circuit boa rd is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the left side. description (recommended footpri nt) aln1747at asb inc. (top view) (bottom view) ? 0.4 plated thru holes to ground plane plerow (side view) c o u pl er website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion c o u pl er c o u pl er c o u pl er c o u pl er 1 - stage single type typ. @ t = 25 ? c, v s = 5 v, freq. = 1747.5 mhz, z o.sys = 50 ohm solder stencil area specifications (in pr o duction)
2 / 3 www.asb.co.kr november 2008 p lerow tm aln1747at internally matched lna module s - param e ters noise figure oip3 p1db 1710~1785 mhz +5 v typical performance (measured) s - parameters & k fa c tor
3 / 3 www.asb.co.kr november 2008 p lerow tm aln1747at internally matched lna module 1) the tantal capacitor is optional and for bypassing the ac noi se introduced from the dc supply. the capacitance value may be dete r mined by customer s dc supply status. 2) so - called dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the d c component in the signal. the dc blocking capacitors are included inside the lna module. therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the appli cation fr e quency. application circuit recommended soldering reflow process evaluation board layout + - aln out in c1 c2 tantal c a pacitor v dc 20~40 sec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) size 25 x 25mm in out +vcc (for aln - at, bt, t series C 10x10mm)
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